Difference between revisions of "Physical Vapor Deposition PVD - Vacuum/thermal coater"
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=== Background === | === Background === | ||
Thermal vacuum coating is one the simplest and oldest of the physical vapor deposition techniques. A solid sample of material is heated in a vacuum and the particles that evaporate travel though the chamber and condense on the substrate. | |||
Thermal vacuum | <swf width="400" height="400">images/4/44/Vacuumdep.swf</swf> | ||
=== Significance === | === Significance === | ||
Thermal evaporation vacuum coating is most often used for depositing metal or metal oxide contacts on flat substrates. It is difficult to control the thickness of the deposit and surface irregularities may cause shadows. The temperature of the source determines the speed of the atoms as they hit the substrate thus making it possible to limit damage to the substrate. This is a relatively rapid technique suitable for roll to roll processing. | |||
=== Operation === | === Operation === | ||
'''Thermal deposition of metals''' | |||
{{#ev:youtube|f7UxBawRPj4}} | |||
'''Physical Vapor Deposition of organic compounds''' | |||
{{#ev:youtube|Ukvs6Rct4w8}} | |||
=== External Links === | === External Links === | ||
see [[wikipedia:Physical_vapor_deposition]] | see [[wikipedia:Physical_vapor_deposition]] | ||
see [[wikipedia:Evaporation_(deposition)]] | see [[wikipedia:Evaporation_(deposition)]] | ||
Latest revision as of 10:17, 9 February 2012
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Background
Thermal vacuum coating is one the simplest and oldest of the physical vapor deposition techniques. A solid sample of material is heated in a vacuum and the particles that evaporate travel though the chamber and condense on the substrate. <swf width="400" height="400">images/4/44/Vacuumdep.swf</swf>
Significance
Thermal evaporation vacuum coating is most often used for depositing metal or metal oxide contacts on flat substrates. It is difficult to control the thickness of the deposit and surface irregularities may cause shadows. The temperature of the source determines the speed of the atoms as they hit the substrate thus making it possible to limit damage to the substrate. This is a relatively rapid technique suitable for roll to roll processing.
Operation
Thermal deposition of metals
Physical Vapor Deposition of organic compounds