Difference between revisions of "Chemical Vapor Deposition"
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=== Background === | |||
[[Image:750px-CVD Reaction Chamber - GPN-2000-001466.jpg|thumb|300px|Chemical Vapor Deposition Apparatus ]] | |||
Chemical Vapor Deposition is a common technique for apply thin films to electronic devices. Chemical reagents are supplied as gases into chamber and allowed to react or decompose at the surface of as substrate and form a new substance. | |||
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=== Significance === | |||
'''Batch CVD''' | |||
CVD is a high volume, high purity process that can be conducted with low vacuum. | |||
In this technique the sample is loaded into a sample holder that can be heated. The bell jar is evacuated and deposition of the sample occurs. Thickness of the coating can be precisely controlled by timing. | |||
<swf width="400" height="400">images/b/b0/Cvd_bell.swf</swf> | |||
'''Continuous Flow CVD''' | |||
In this method heated reactants are fed into the chamber continuously. The reaction happens close to the moment of deposition. The flow rate of the gases can be used to efficiently support the stoichiometry of the reaction. | |||
<swf width="600" height="400">images/6/62/Cvd.swf</swf> | |||
=== Operation=== | |||
=== External Links === | |||
*[[wikipedia:Chemical_vapor_deposition]] | |||
*[http://www.youtube.com/watch?v=gtJqNqXLg9w&feature=related Chemical Vapor Deposition video] | |||
*[http://www.youtube.com/watch?v=gtJqNqXLg9w&feature=related Plasma CVD video] | |||
*[http://cnx.org/content/m25495/latest/ Connexions Chemistry of Electronic Materials] | |||
Latest revision as of 10:35, 9 February 2012
| Return to Research Tool Menu |
Background
Chemical Vapor Deposition is a common technique for apply thin films to electronic devices. Chemical reagents are supplied as gases into chamber and allowed to react or decompose at the surface of as substrate and form a new substance.
Significance
Batch CVD CVD is a high volume, high purity process that can be conducted with low vacuum. In this technique the sample is loaded into a sample holder that can be heated. The bell jar is evacuated and deposition of the sample occurs. Thickness of the coating can be precisely controlled by timing.
<swf width="400" height="400">images/b/b0/Cvd_bell.swf</swf>
Continuous Flow CVD In this method heated reactants are fed into the chamber continuously. The reaction happens close to the moment of deposition. The flow rate of the gases can be used to efficiently support the stoichiometry of the reaction.
<swf width="600" height="400">images/6/62/Cvd.swf</swf>