View source for Project 4.2 Packaging and Processing for Printed Electronics

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A first objective of this project will be to develop thin film encapsulation layers with permeation rates at or below 10<sup>-5</sup> g/m<sup>2</sup>/day and to integrate them with organic photovoltaic cells, OLEDs, and organic circuits.  Additional efforts to reduce the number of layers and processing steps needed for the encapsulation will be performed with goal of a single or bilayer encapsulation film.  Finally, an understanding of the mechanics of the encapsulation film (adhesion, residual stress, etc.) and its impact on encapsulation reliability under flexure will also be addressed.  Packaging research will focus simultaneously on providing good barriers to moisture and oxygen, and on characterizing and modeling their mechanical performance. A second objective of this project is to advance the science of processing techniques such as ink-jet printing that will enable the development of low cost, large area manufacturing processes based on organic and hybrid materials developed in the Center. 

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http://www.stc-mditr.org/research/lsoe/projects.cfm