Magnetron Sputtering Coater - Revision history

Cmditradmin: /* Operation */

2015-08-27T19:56:21Z

Operation

← Older revision		Revision as of 12:56, 27 August 2015
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	{{#ev:youtube\|~~8oW16hwxkQs~~}}		{{#ev:youtube\|lUf5r9WyjFo}}

	=== References ===		=== References ===

	see [[wikipedia:Sputter_deposition]]		see [[wikipedia:Sputter_deposition]]

Cmditradmin: /* Operation */

2015-08-27T19:54:43Z

Operation

← Older revision		Revision as of 12:54, 27 August 2015
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	=== Operation ===		=== Operation ===
	{{#ev:youtube\|NSb4zFzQD_0}}		{{#ev:youtube\|NSb4zFzQD_0}}


			{{#ev:youtube\|8oW16hwxkQs}}

	=== References ===		=== References ===

	see [[wikipedia:Sputter_deposition]]		see [[wikipedia:Sputter_deposition]]

Cmditradmin at 17:42, 11 October 2011

2011-10-11T17:42:52Z

← Older revision		Revision as of 10:42, 11 October 2011
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	<table id="toc" style="width: 100%">		<table id="toc" style="width: 100%">
	<tr>		<tr>
	<td style="text-align: center; width: 33%">[[Main_Page#~~Research Equipment, Devices and Techniques~~\|Return to Research Tool Menu]]</td>		<td style="text-align: center; width: 33%">[[Main_Page#Synthesis_and_Fabrication\|Return to Research Tool Menu]]</td>

	</tr>		</tr>
	</table>		</table>
	=== Background ===		=== Background ===
	Magnetron sputtering deposition is a fast technique for applying a thin layer of inorganic materials on a substrate, such as ITO or metallic contacts. The magnetron ionizes argon gas which then accelerates towards the cathode where the target materials is located. The stream of argon ions erodes away the target material making a charged cloud which then deposits on the substrate located at the anode.		Magnetron sputtering deposition is a fast technique for applying a thin layer of inorganic materials on a substrate, such as ITO or metallic contacts. The magnetron ionizes argon gas which then accelerates towards the cathode where the target materials is located. The stream of argon ions erodes away the target material making a charged cloud which then deposits on the substrate located at the anode.

Cmditradmin at 16:16, 5 October 2011

2011-10-05T16:16:01Z

← Older revision		Revision as of 09:16, 5 October 2011
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			<table id="toc" style="width: 100%">
			<tr>
			<td style="text-align: center; width: 33%">[[Main_Page#Research Equipment, Devices and Techniques\|Return to Research Tool Menu]]</td>

			</tr>
			</table>
	=== Background ===		=== Background ===
	Magnetron sputtering deposition is a fast technique for applying a thin layer of inorganic materials on a substrate, such as ITO or metallic contacts. The magnetron ionizes argon gas which then accelerates towards the cathode where the target materials is located. The stream of argon ions erodes away the target material making a charged cloud which then deposits on the substrate located at the anode.		Magnetron sputtering deposition is a fast technique for applying a thin layer of inorganic materials on a substrate, such as ITO or metallic contacts. The magnetron ionizes argon gas which then accelerates towards the cathode where the target materials is located. The stream of argon ions erodes away the target material making a charged cloud which then deposits on the substrate located at the anode.

Cmditradmin at 19:58, 11 August 2011

2011-08-11T19:58:35Z

← Older revision		Revision as of 12:58, 11 August 2011
Line 1:		Line 1:

	=== Background ===		=== Background ===
	Magnetron sputtering deposition is a fast technique for applying a thin layer of inorganic materials on a substrate, such as ITO or metallic contacts. The magnetron ionizes argon gas which then accelerates towards the cathode where the target materials is located. The stream of argon ions erodes away the target material making a charged cloud which then deposits on the substrate located at the anode.		Magnetron sputtering deposition is a fast technique for applying a thin layer of inorganic materials on a substrate, such as ITO or metallic contacts. The magnetron ionizes argon gas which then accelerates towards the cathode where the target materials is located. The stream of argon ions erodes away the target material making a charged cloud which then deposits on the substrate located at the anode.

	<swf width="500" height="400">images/5/5f/Sputtering.swf</swf>		<swf width="500" height="400">images/5/5f/Sputtering.swf</swf>

			=== Significance ===
			Magnetron sputtering is very versatile and can be used to apply just about any material. It is especially well suited to materials with a high melting point which would be difficult to melt in a normal vacuum thermal deposition system. It is often used to coating entire surfaces because it is difficult to control where the material go precisely. Adhesion is excellent.

	=== Operation ===		=== Operation ===

Cmditradmin: /* Operation */

2011-08-11T19:45:21Z

Operation

← Older revision		Revision as of 12:45, 11 August 2011
Line 6:		Line 6:

	=== Operation ===		=== Operation ===
	{{#ev:youtube\|~~1N3LRt-oSlk~~}}		{{#ev:youtube\|NSb4zFzQD_0}}

	=== References ===		=== References ===

	see [[wikipedia:Sputter_deposition]]		see [[wikipedia:Sputter_deposition]]

Cmditradmin: /* Operation */

2011-06-16T23:02:39Z

Operation

← Older revision		Revision as of 16:02, 16 June 2011
Line 6:		Line 6:

	=== Operation ===		=== Operation ===
	{{#ev:youtube\|~~HvJv8ZwFk7U~~}}		{{#ev:youtube\|1N3LRt-oSlk}}

	=== References ===		=== References ===

	see [[wikipedia:Sputter_deposition]]		see [[wikipedia:Sputter_deposition]]

Cmditradmin: /* Background */

2010-10-11T16:28:49Z

Background

← Older revision		Revision as of 09:28, 11 October 2010
Line 3:		Line 3:
	Magnetron sputtering deposition is a fast technique for applying a thin layer of inorganic materials on a substrate, such as ITO or metallic contacts. The magnetron ionizes argon gas which then accelerates towards the cathode where the target materials is located. The stream of argon ions erodes away the target material making a charged cloud which then deposits on the substrate located at the anode.		Magnetron sputtering deposition is a fast technique for applying a thin layer of inorganic materials on a substrate, such as ITO or metallic contacts. The magnetron ionizes argon gas which then accelerates towards the cathode where the target materials is located. The stream of argon ions erodes away the target material making a charged cloud which then deposits on the substrate located at the anode.

	<swf width="500" height="400">/images/5/5f/Sputtering.swf</swf>		<swf width="500" height="400">images/5/5f/Sputtering.swf</swf>

	=== Operation ===		=== Operation ===

Cmditradmin: /* Background */

2010-10-11T16:28:27Z

Background

← Older revision		Revision as of 09:28, 11 October 2010
Line 2:		Line 2:
	=== Background ===		=== Background ===
	Magnetron sputtering deposition is a fast technique for applying a thin layer of inorganic materials on a substrate, such as ITO or metallic contacts. The magnetron ionizes argon gas which then accelerates towards the cathode where the target materials is located. The stream of argon ions erodes away the target material making a charged cloud which then deposits on the substrate located at the anode.		Magnetron sputtering deposition is a fast technique for applying a thin layer of inorganic materials on a substrate, such as ITO or metallic contacts. The magnetron ionizes argon gas which then accelerates towards the cathode where the target materials is located. The stream of argon ions erodes away the target material making a charged cloud which then deposits on the substrate located at the anode.

			<swf width="500" height="400">/images/5/5f/Sputtering.swf</swf>

	=== Operation ===		=== Operation ===

Cmditradmin: /* Background */

2010-09-09T21:28:01Z

Background

← Older revision		Revision as of 14:28, 9 September 2010
Line 1:		Line 1:

	=== Background ===		=== Background ===
	Magnetron sputtering deposition is a fast technique for applying a thin layer of inorganic materials on a substrate, such as ITO or metallic contacts. The magnetron ionizes argon gas which then accelerates towards the cathode where the target materials is located. The stream of ions erodes away the target material making a charged cloud which then deposits on the substrate located at the anode.		Magnetron sputtering deposition is a fast technique for applying a thin layer of inorganic materials on a substrate, such as ITO or metallic contacts. The magnetron ionizes argon gas which then accelerates towards the cathode where the target materials is located. The stream of argon ions erodes away the target material making a charged cloud which then deposits on the substrate located at the anode.

	=== Operation ===		=== Operation ===